Originally posted by mvdvarrier
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Originally posted by mvdvarrier
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Perhaps you know this, but try to use the least amount of thermal compound possible, as long as it covers the entire intersection between the SoC and heat sink. Using more thermal compound than necessary will actually reduce thermal conductivity, since it's not as conductive as the metal of the heat sink.
BTW, perhaps the heat sink you're using is copper? Copper is the best (solid) heat sink material, while aluminum is second best and more common (since it's cheaper).
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