Good question about the heat sink. My guess would be that they expect the boards to go into compact enclosures. A heat sink can make a big difference in such an enclosure.
As to the ITE chip, maybe Micheal can work up a list of boards without this chip. On the other hand you can't expect instant support for new hardware. Maybe Phoronix needs a compatibility test and report. It has already been demonstrated that these boards need the newest kernels. & etc.
As to the ITE chip, maybe Micheal can work up a list of boards without this chip. On the other hand you can't expect instant support for new hardware. Maybe Phoronix needs a compatibility test and report. It has already been demonstrated that these boards need the newest kernels. & etc.
Originally posted by NotMine999
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