Thermaltake ITBU CL-P0303

Examination:

Grasping the heatsink, it does have a good weight to it due to the number of copper fins as well as the dual heatpipes. Packed into the 86.5 x 76.2 x 50.29 mm area are 58 copper heatsinks, which are all in turn connected to the copper base. Running through these fins are two heatpipes. Providing the active cooling for the heatsink is a 70mm fan that is able to push 23.49 CFM at 29.1 dB. The maximum fan speed is 3600RPM, however, it does utilize a 4-pin design for benefiting from Pulse Width Modulation, and so these numbers do vary. The life expectancy of the fan is rated for 40,000 hours.

The four screws are spring-loaded for easy installation on the LGA-771 socket. The installation is quite easy, and the ITBU CL-P0303 is meant for use in 2U environments. As the thermal compound comes pre-applied, protecting the base during shipping was a small plastic cover. The compound that comes pre-applied is Dow Corning TC-5022 interface material. Dow Corning TC-5022 has a thermal conductivity of 4.0 Watts/meter-k. The total weight of the heatsink itself is 699 grams.